Intel recently announced that, for the first time since the invention of silicon transistors over 50 years ago, chips will be manufactured in high volumes using transistors that have a ...

Researchers developed a microfluidic chip with 3D-printed microstructures that moves droplets precisely, captures cells efficiently, and quickly forms cell spheroids for improved lab-grown tissue ...

Researchers at MIT have developed a fabrication approach that stacks multiple active components on the back end of a ...

3D chips and multi-die assemblies can offer significant improvements in performance and power, but the tradeoff is the increased amount of time and money it takes to generate working silicon. There ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

John Kibarian, CEO of PDF Solutions, talks with Semiconductor Engineering’s Ed Sperling about the growing role of AI in chip ...

Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera™ system enables higher ...

Most cells in the human body exist in complex three-dimensional environments, yet they are still commonly studied on flat ...

Key opportunities include the growth of high-performance computing, automotive electronics, and IoT applications 3D ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

A stacked chip captures, encrypts, and searches image data directly on hardware, combining photodetection, memory, and key generation for secure real-time processing in connected devices. (Nanowerk ...