Integrated electronic circuitries with pressure sensors have been extensively researched as a key component for emerging electronics applications such as electronic skins (e-skins) 1,2,3,4,5,6,7,8,9 ...
The general fabrication process flow is designed to enable high device yield, device-to-device uniformity, good material compatibility between layers, and good electrical and mechanical performances.
The tight integration of electronics and optical functions via silicon MEMS technology goes far beyond the simple combining of LEDs, phototransistors, and similar components. With the growth in links ...
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