This is the final of a two-part article on the use of staple pins in food packaging that can pose safety issues for consumers. KUALA LUMPUR (Bernama) – Incidents involving the accidental swallowing of ...
Using an HMIC silicon glass process to integrate PIN diodes with a low dispersion and loss glass medium, the MA4SPS421, MA4SPS422, and MA4PD-042005 Series of diodes have no packaging and target mobile ...