Known for its sleek and simple design, CAEPIPE now adds more power and flexibility to its already formidable processing engine. Imagine all these NEW features in addition to the standard statics, ...

Intergraph Releases CAESAR II 2011 R1 for advanced integration with Smart 3D & SmartPlant Review for data transfer from piping design to the engineering environment. Intergraph has released an ...

Theory of elasticity: elastic stability, principal of minimum potential energy, Raylegh-Ritz methods. Introduction to finite element methods of stress analysis: computer implementation and use of ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

On May 3 at JEC World 2022, Collier Aerospace Corp. (Newport News, Va., U.S.) introduced its new HyperX design and analysis software for composite and metallic structures used in aircraft, space and ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...