Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, but how fast it can feed itself data. The long-feared “memory wall” is now ...

Researchers at MIT have developed a fabrication approach that stacks multiple active components on the back end of a ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

Cultured neural tissues have been widely used as a simplified experimental model for brain research. However, existing devices for growing and recording neural tissues, which are manufactured using ...

Cancer research laboratory tests can now be done using micro-physiological systems mimicking human physiology, allowing ...

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced ...

A new chip-based quantum memory uses nanoprinted “light cages” to trap light inside atomic vapor, enabling fast, reliable storage of quantum information. The structures can be fabricated with extreme ...

Semiconductor chiplets represent an advancement in microchip design. They divide traditional monolithic systems into smaller, modular components. Unlike traditional monolithic SoCs, which integrate ...